Flexible Electronics News

STMicroelectronics Details Plans to Reshape Footprint

Planned investments to focus on advanced manufacturing 300mm silicon, 200mm silicon carbide, and technology R&D.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

STMicroelectronics N.V. disclosed further elements of its program to reshape its global manufacturing footprint. This comes as part of the program announced in October 2024 to further strengthen ST’s competitiveness, solidify its position as a global semiconductor leader, and ensure the long-term sustainability of its model as an integrated device manufacturer by leveraging strategic assets globally across technology R&D, design and high-volume manufacturing. “The reshaping of our manufac...

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